ISO 16525-9:2014
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ISO 16525-9:2014
59287
Status : Published (Under review)
This standard was last reviewed and confirmed in 2019. Therefore this version remains current.
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Format Language
std 1 166 PDF + ePub
std 2 166 Paper
  • CHF166
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Abstract

ISO 16525-9:2014 specifies test methods to investigate the high-speed signal-transmission characteristics in the bonded portions of an isotropic electrically conductive adhesive, which joins the terminals of a surface mounted device (SMD) and the land grid patterns of a printed circuit board. It also investigates the characteristics of wiring with an isotropic electrically conductive adhesive, which can be applied on to the printed circuit board.

General information

  •  : Published
     : 2014-05
    : International Standard confirmed [90.93]
  •  : 1
     : 45
  • ISO/TC 61/SC 11
    83.180 
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