ISO 9453:2006 - Soft solder alloys — Chemical compositions and forms

Withdrawn (Edition 2, 2006)

New version available: ISO 9453:2020

Abstract

ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys:

tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;
tin-antimony;
tin-bismuth;
tin-copper, with and without silver;
tin-indium, with and without silver and bismuth;
tin-silver, with and without copper and bismuth;
tin-zinc, with and without bismuth.

ISO 9453:2006 also includes an indication of the forms generally available.

General information

Status
: Withdrawn

Publication date
: 2006-10

Stage
: Withdrawal of International Standard [95.99]
Edition
: 2

Number of pages
: 10
Technical Committee :
ISO/TC 44/SC 12

ICS :
25.160.50
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